Ceramic bonded diamond grinding wheel has high strength, good heat resistance, sharp cutting, high grinding efficiency, grinding process is not easy to heat and block, a small amount of thermal expansion to control the machining accuracy. Compared with the resin bonded grinding wheel, he solved the low life of resin diamond grinding wheel, grinding efficiency is low, the abrasive itself in the grinding process of the issue of variability. The combination of the above advantages of the diamond grinding wheel and the diamond grinding wheel has been widely applied to the wafer (semiconductor wafer and solar wafer), diamond composite film, diamond polycrystalline, diamond cutter, cubic boron nitride, tungsten steel Hard alloy), the new engineering structure ceramics, precious stones, crystal, rare earth materials (magnetic materials) and other high hard and brittle materials, mechanical processing, and achieved good economic benefits.
1, high grinding efficiency;
2, with high wear resistance (high wear resistance of the wheel, abrasive wear less, especially when the workpiece is hard and brittle grinding the most obvious);
3, grinding force is small, grinding temperature is low;
4, high-precision grinding of the workpiece, the surface quality, good shape retention of the workpiece.
Therefore, the ceramic bonding agent diamond grinding wheel in diamond, industrial ceramics, diamond composite films, diamond polycrystalline, diamond cutting tools, cubic boron nitride, carbide and other high hardness and brittle materials and other special materials, grinding process, with more and more Obvious advantages, in the development of diamond abrasive has a good prospect. It is considered as a high-performance abrasive tool with high speed, high efficiency, high precision, low grinding cost and low environmental pollution. It has more and more extensive applications and is a hot spot competing in research and development of grinding tools all over the world.